due to the shrinking pitch of the BGA, through the resin plug hole,, 0201, 0402 and other small chip components, buried blind hole, the chip body does not need to be soldered in the middle of the pin, so the hole in the IC thermal pad is not to consider the leakage of tin, false solder and other issues.
CTI, Definition of creepage spacing and electrical clearance,,high-voltage PCB , he current system voltage is 220V, the creepage distance in the high-voltage design according to these values, the layout of the PCB to adjust the device pad to pad spacing, and creepage spacing sometimes if the space on the PCB board is relatively tight when you can increase the creepage spacing by digging a slot,e
PCBA board in the reflow and wave soldering,PCBA board size and the number of board collocation,the depth of the V-Cut,PCBA board laying copper area is uneven,the connection points of the layers on the PCBA board
reflow soldering preheating time is short, the heating speed is fast. Low splatter solder paste helps reduce gold finger tinning.Proper gold finger plating reduces exposed nickel. the printing machine pressure is too large, resulting in part of the solder paste is squeezed out of the control range,
USB3.0 introduction of full-duplex data transmission, USB layout and wiring has its corresponding design requirements. t, the USB interface PCB layout requirements,GND and signal GND isolation,PCB design,a total of six pairs of differential lines. USB3.0 introduction of full-duplex data transmission, USB layout and wiring has its corresponding design requirements.
VDD_CPU_LIT schematic power supply pin decoupling capacitor,the chip power supply pins of the copper cladding is wide enough,RK3588 VDD_CPU_LIT Power PCB Design, VDD_CPU_LIT schematic power supply pin decoupling capacitor
Resistance, which indicates the magnitude of a conductor's impediment to electric current.colour ring resistor,. Chip resistors are small, lightweight, stable and reliable, suitable for automated production line assembly.
in the case of SMT placement production,hether the vias can be punched on the pads or not needs to be decided according to the specific application scenarios and design requirements. a professional PCB design engineer or PCB manufacturer for accurate advice and guidance.
