Ceramic PCB Capability
| 96% or 98% Alumina (Al2O3), Aluminum Nitride (AIN), or Beryllium Oxide (BeO) | |
| Conductors material: |
For thin, thick film technology, it’ll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it’ll be copper only |
| Application temp: | -55~800℃ |
| Thermal conductivity value: | 24W~28W/m-K (Al2O3); 150W~240W/m-K for AIN , 220~250W/m-K for BeO; |
| Max compression strength: | >6,000 N/cm2 |
| Breakdown Voltage (KV/mm): | 15/20/28 for 25mm/0.63mm/1.0mm respectively |
| Thermal expansion conefficient(ppm/K): | 7.5 (under 50~190℃) |