HDI PCB Capability
| Number | Item | Sample technical capability | Batch technical capability | ||||
| 1 | plate | FR-4 High TG/PTFE/Ceramic PCB/Polyimide | FR-4 High TG/PTFE/Ceramic PCB/Polyimide | ||||
| 2 | Printed board type | PCB/HDI | |||||
| 3 | HDI layers | 30 | 24 | ||||
| 4 | HDI stack-up | （1+N+1) | （2+N+2）alignment | （3+N+3）alignment | （1+N+1) | （2+N+2）alignment | （3+N+3） |
| （1+1+N1+1+1）misalignment | （1+1+1+N+1+1+1）misalignment | （1+1+N1+1+1）misalignment | （1+1+1+N+1+1+1） | ||||
| （1+2+N+2+1）alignment+misalignment | （1+2+N+2+1） | ||||||
| （2+1+N+1+3）alignment+misalignment | （2+1+N+1+3） | ||||||
| 5 | Min hole/Pad | 4mil/0.1mm（bind hole）/Pad 10mil/0.25mm | |||||
| 8mil0.2mm(buried hole）/Pad 14mil0.35mm | |||||||
| 6 | Min trace width/spacing | 3.5mil/3.5mil(copper 1 OZ ） | |||||
| 2.5mil/2.5mil (copper 1/3 OZ ） | |||||||
| 7 | Blind buried hole design rule |
1. Where the design of buried holes, as long as the hole through the inner core board, can only design a minimum of 0.2mm mechanical hole buried holes, can not design a minimum of 0.1mm laser hole, the reason is that 0.1mm laser hole can not penetrate the inner core board.
2. Where the design of blind holes, the smallest hole can only be 0.1mm laser hole, regardless of whether it is the align or misaligned, can not be designed more than 0.15mm laser hole
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| 8 | Min Outline | 5mm*5mm | |||||
| 9 | Max Outline | 609mm*889mm | |||||
| 10 | Min base copper | 1/3 OZ (12um) | 1/3 OZ (12um) | ||||
| 11 | Max finished copper | 6 OZ | 6 OZ | ||||
| 12 | Min trace width/spacing | ≥3/3mil (0.076mm) 4/4mil(finished copper 1oz)，5/5mil(finished copper 2oz)8/8mil(finished copper 3oz) | |||||
| 13 | |||||||
| 14 | Mini distance from hole to inner conductor | 6 mil/0.15mm | |||||
| 15 | Min spacing from hole to outer conductor | ||||||
| 16 | Min via hole annular ring | 3 mil/0.075mm | |||||
| 17 | Min PTH hole solder ring | 5 mil/0.125mm | |||||
| 18 | Min BGA PAD | 8 mil/0.2mm | |||||
| 19 | Min finished hole size | 0.15mm(Mechanical)/ 0.1mm(laser） | |||||
| 20 | Mechanical hole Diameter（finished） | 0.15-0.62mm(Corresponding drilling tool 0.15-6.3mm) | |||||
| 21 | Mechanical buried blind hole≤0.3mm(Corresponding drilling tool 0.35mm) | ||||||
| 22 | Via in PAD green oil plug hole drilling diameter≤0.45mm(Corresponding drilling tool 0.55mm) | ||||||
| 23 | Min. connected hole 0.35mm(Corresponding drilling tool 0.45mm) | ||||||
| 24 | Half plated hole min hole 0.30mm(Corresponding drilling tool 0.40mm) | ||||||
| 25 | 0.1/0.15/0,2mm maximum plate thickness for mechanical drilling | 0.8mm/1.5mm/2.5mm | |||||
| 26 | Minimum laser drill hole diameter | 0.1mm | |||||
| 27 | Maximum laser drill hole diameter | 0.15mm | |||||
| 29 | Drilling - hole position tolerance | ±2mil | |||||
| 30 | Drill-NPTH hole minimum tolerance of hole diameter | ±2mil | |||||
| 31 | Drill hole - no solder hole tolerance | ±2mil | |||||
| 32 | Drilling - Countersunk hole depth tolerance | ±0.15mil | |||||
| 33 | Drilling - Countersunk hole width tolerance | ±0.15mil | |||||
| 34 | Laser hole inside, outer pad size minimum | 10mil(4mil laser hole）,11mil(5mil laser hole） | |||||
| 35 | Maximum board thickness to hole ratio | 20:01 | 12:01 | ||||
| 36 | Minimum half-hole diameter | 0.4mm | 0.5mm | ||||
| 37 | Minimum insulation layer thickness | 2mil | |||||
| 38 | Surface treatment | ENIG/HASL/HASL-LF/OSP/IMMERSION SILVER/IMMERSION SN/PLATE GOLD/PLATE SILVER | |||||
| 39 | Minimum half-hole diameter | 0.4mm | 0.45mm | ||||
| 40 | Gold finger thick | 10-30u | 10-30u | ||||
| 41 | Countersunk hole diameter | 0.8mm-3.0mm | 0.8mm-3.0mm | ||||
| 42 | Via in PAD hole diameter | 0.15mm-3.0mm | 0.15mm-3.0mm | ||||
| 43 | Press fit hole tolerance | PTH/NPTH hole ±0.05mm | |||||
| 44 | Impedance hole tolerance | 8% | 10% | ||||