Rigid Flex PCB Capability
Item | Parameters & Description | |
Layers | Rigid-flex board:2 - 26 layers | |
Plate | FR-4, PI | |
Max size | 2- 4 layer: 500mm x 1000mm | |
>=8 layer: 500mm * 800mm | ||
Outline Tolerance | CNC: ±5mil | |
Laser:±2mil | ||
Finish board thick | 0.10mm- 7mm | |
Min board thick | 2-4 layer:0.25mm | |
6 layer:0.50mm | ||
Board tolerance | ±10% | |
Impedance control | ±10% | |
Min trace width/space | Inner layer | Out layer |
1/3oz: 2/2mil | Hoz: 3/3mil | |
Hoz: 3/3mil | 1oz: 4/4mil | |
1oz: 5/5mil | 2oz: 5/6mil | |
2oz: 5/7mil | 3oz: 7/8mil | |
3oz: 7/8mil | 4oz: 10/10mil | |
4oz: 10/10mil | 5oz: 12/12mil | |
5oz 12/12mil | 6oz: 15/12mil | |
6oz/ 15/12mil | ||
Out layer copper thick | Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | |
Inner layer copper thick | 1/3oz, Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | |
Min finished hole size | Mechanical hole:6mil | |
Laser hole:3mil | ||
Inner layer alignment precision | ±2mil | |
Min annular ring | Inner layer: | Out layer: |
Hoz: 4mil | 1/ 3oz -Hoz: 4mil | |
1oz: 6mil | 1oz: 5mil | |
2oz: 8mil | 2oz: 7mil | |
3oz: 12mil | 3oz: 10mil | |
4oz: 15mil | 4oz: 16mil | |
5oz: 18mil | 5oz: 18mil | |
6oz: 20mil | 6oz: 20mil | |
Max ratio of plated holes and board thick | 10:01 | |
Silkscreen color | White,black,yellow | |
Soldermask color | Bright: green, white, blue, black, yellow, red | |
Matte: green, black, blue | ||
Soldermask thickness | >=2mil | |
Min soldermask bridge | 4mil | |
Soldermask plug hole diameter | 10mil – 24mil | |
warp | ≤0.75% | |
Surface treatment | HASL, lead-free HASL, immersion gold, immersion tin, immersion silver, OSP, gold finger | |
Acceptable standard | IPC Class II, IPC Class III |