Flex PCB Capability
| Item | Parameters & Description | |
| Layers | FPC: 1-12layer | |
| plate | PI | |
| Max size | 1- 2layer：500 * 1200mm | |
| >=2layer：500 * 800mm | ||
| Outline tolerance | CNC： ±5mil | |
| layer：±2mil | ||
| Finished board thick | 0.10mm- 7mm | |
| Min board thick | 1-layer：0.05mm | |
| 2-layer：0.10mm | ||
| Board thick Tolerance | ±10% | |
| Impedance control | ±10% | |
| Min trace width/spacing | Inner layer | Out layer |
| 1/3oz: 2/2mil | Hoz: 3/3mil | |
| Hoz: 3/3mil | 1oz: 4/4mil | |
| 1oz: 5/5mil | 2oz: 5/6mil | |
| 2oz: 5/7mil | 3oz: 7/8mil | |
| 3oz: 7/8mil | 4oz: 10/10mil | |
| 4oz: 10/10mil | 5oz: 12/12mil | |
| 5oz 12/12mil | 6oz: 15/12mil | |
| 6oz/ 15/12mil | ||
| Out layer copper thick | Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | |
| Inner layer copper thick | 1/3oz, Hoz, 1oz, 2oz, 3oz, 4oz, 5oz, 6oz | |
| Min finished hole size | Mechanical hole：6mil | |
| Laser hole：3mil | ||
| Inner layer alignment precision | ±2mil | |
| Min annular ring | Inner layer: | Out layer: |
| Hoz: 4mil | 1/ 3oz -Hoz: 4mil | |
| 1oz: 6mil | 1oz: 5mil | |
| 2oz: 8mil | 2oz: 7mil | |
| 3oz: 12mil | 3oz: 10mil | |
| 4oz: 15mil | 4oz: 16mil | |
| 5oz: 18mil | 5oz: 18mil | |
| 6oz: 20mil | 6oz: 20mil | |
| Max ratio of board thick and plated hole | 10:01 | |
| Silkscreen color | White,black,yellow | |
| Soldermask color | Bright: green, white, blue, black, yellow, red | |
| Matte: green, black, blue | ||
| Soldermask thick | >=2mil | |
| Min soldermask bridge | 4mil | |
| Soldermask plug hole diameter | 10mil – 24mil | |
| Warp | ≤0.75% | |
| Surface treatment | HASL, lead-free HASL, immersion gold, immersion tin, immersion silver, OSP, gold finger | |
| Acceptable standard | IPC Class II, IPC Class III | |