Description
layers:8
board thick:2.5mm
PCB & component assembly
copper thick:2oz
soldermask:green
silkscreen:white
surface treatment:immersion gold
The test process of the computer motherboard PCBA usually includes the following steps:
1. Program burning: Burn the MCU program into the single-chip microcomputer on the PCBA board to enable it to realize specific functions.
2. ICT test: Through the test probe contacting the test points of the PCBA, the test of the open circuit and short circuit of the circuit of the PCBA and the soldering situation of the electronic components is realized.
3. FCT test: Test the parameters such as the environment, current, voltage, and pressure of the PCBA to ensure that various parameters of the PCBA board meet the design requirements of the designer.
4. Aging test: Simulate the aging process of the product under actual usage conditions to detect its reliability and stability.
It should be noted that the specific test process may vary depending on the type and purpose of the product and the requirements of the customer. When conducting PCBA testing, the corresponding test plan should be formulated according to the actual situation and operate strictly in accordance with the test process to ensure the accuracy and reliability of the test results.
